Device testing contactor, method of producing the same, and device testing carrier

ABSTRACT

A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention generally relates to a semiconductor devicetesting contactor, a method of producing the semiconductor devicetesting contactor, and a semiconductor device testing carrier. Moreparticularly, the present invention relates to a semiconductor devicetesting contactor which obtains electrical contact with a semiconductordevice such as a bare chip, a BGA (Ball Grid Array), an SOP (SmallOutline Package), or a QFP (Quad Flat Package), a method of producingsuch a semiconductor device testing contactor, and a semiconductordevice testing carrier.

[0003] 2. Description of the Related Art

[0004] In recent years, there has been an increasing demand for small,high-speed, and high-density semiconductor devices. The electrodesdisposed in these semiconductor devices have become smaller accordingly.As a result, a semiconductor device testing contactor is now expected tobe capable of obtaining reliable electrical connection with a smallsemiconductor device with small electrodes.

[0005] A semiconductor device testing contactor used for testing asemiconductor device is electrically connected to the electrodes of asemiconductor device to be tested. Such a semiconductor device testingcontactor includes a wiring board having electrode pads to beelectrically connected to the electrodes of the semiconductor device. Asmentioned above, semiconductor devices have been becoming smaller insize, and higher in speed and density. To be compatible with suchsemiconductor devices, a membrane-type wiring board having a conductivepattern on a polyimide film is often employed as the wiring board of asemiconductor device testing contactor. The membrane-type wiring boardhas a minutely formed conductive pattern so as to be able to conform tothe minute electrode pads of a semiconductor device to be tested.

[0006] Since the membrane-type wiring board has flexibility, it requiresa reinforcing member when used as a semiconductor device testingcontactor. For this reason, a conventional semiconductor device testingcontactor has the reinforcing member for reinforcing the membrane-typewiring board.

[0007] Techniques of attaching the reinforcing member to themembrane-type wiring board include a technique using double-sidedadhesive tape or adhesives (hereinafter referred to as “adhesiontechnique”), and a technique using screws to fasten the membrane-typewiring board to the reinforcing member (hereinafter referred to as“mechanical fastening technique”).

[0008] Besides the main components (the membrane-type wiring board andthe reinforcing member), the adhesion technique requires thedouble-sided tape or adhesives, and the mechanical fastening techniquerequires screws. This results in problems that the number of componentsbecomes larger, and that the production costs of the semiconductordevice testing contactor are increased.

[0009] Furthermore, when the adhesion technique or the mechanicalfastening technique is employed, it is necessary to perform adouble-sided adhesive tape attaching process, an adhesive applyingprocess, or a screw tightening process. This makes the productionprocedures of the semiconductor device testing device more complicated.

[0010] When the adhesion technique is employed, thermal deteriorationoccurs to the adhesives or the double-sided tape due to the differencein thermal expansion between the membrane-type wiring board and thereinforcing member at the time of a burn-in test, for instance. Thethermal deterioration of the adhesives or the double-sided adhesive tapecauses wrinkles which results in a positional shift of the membrane-typewiring board with respect to the reinforcing member. With such apositional shift, there is a possibility that the conductive pattern onthe membrane-type wiring board cannot be electrically connected to theelectrode pads of the semiconductor device.

SUMMARY OF THE INVENTION

[0011] A general object of the present invention is to provide a devicetesting contactor in which the above disadvantages are eliminated.

[0012] A more specific object of the present invention is to provide adevice testing contactor, a method of producing the contactor, and adevice testing carrier, in which the number of components is smaller,the production procedures are simpler, and the reliability is improved.

[0013] The objects of the present invention are achieved by providing adevice testing contactor which includes: a wiring board having aflexible substrate and electrode pads formed on the substrate; and afirst reinforcing member which reinforces the wiring board. Theelectrode pads are electrically connected to the electrodes of a device.The first reinforcing member is formed by a mold. The wiring board andthe first reinforcing member are collectively bonded and molded.

[0014] The objects of the present invention are also achieved byproviding a device testing carrier which includes: a device testingcontactor; a pressure mechanism which pushes a device toward a wiringboard provided in the device testing contactor; and a cushion memberwhich absorbs a pressing force of the pressure mechanism.

[0015] The objects of the present invention are also achieved by amethod of producing a device testing contactor, which method includesthe steps of: mounting a wiring board to a metal mold made up of anupper mold and a lower mold provided with a lower cavity having a shapecorresponding to the shape of a first reinforcing member; and formingthe first reinforcing member by injecting a reinforcing material intothe metal mold, so that the wiring board and the first reinforcingmember are collectively bonded.

[0016] The objects of the present invention are also achieved by amethod of testing a device, which method includes the step ofelectrically connecting go the electrode pads of a device testingcontactor to the electrodes of the device. The electrode pads are formedon the wiring board of the device testing contactor, and are reinforcedby a reinforcing member. The device testing contactor has the wiringboard and the reinforcing member collectively bonded to each other.

[0017] With this structure, no fixing devices, such as double-sidedadhesive tape, adhesives, or screws, are necessary in fixing the wiringboard and the first reinforcing member. Thus, the number of componentsand the production costs can be reduced. In this structure, it is notnecessary to carry out an adhesion technique using double-sided adhesivetape or adhesives and a fastening technique using screws, therebysimplifying the production procedures of the device testing contactor.Also, wrinkles due to deterioration of adhesives can be prevented, andthe connection reliability with the device can be improved.

[0018] The device testing carrier described above can provide the sameeffects as the device testing contactor.

[0019] The above and other objects and features of the present inventionwill become more apparent from the following description taken inconjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020]FIGS. 1A and 1B illustrate a contactor of a first embodiment ofthe present invention;

[0021]FIGS. 2A and 2B illustrate a contactor of a second embodiment ofthe present invention;

[0022]FIG. 3 illustrates a contactor of a third embodiment of thepresent invention;

[0023]FIGS. 4A to 4C illustrate a contactor of a fourth embodiment ofthe present invention;

[0024]FIG. 5 illustrates a contactor of a fifth embodiment of thepresent invention;

[0025]FIG. 6 illustrates a contactor of a sixth embodiment of thepresent invention;

[0026]FIG. 7 illustrates a contactor of a seventh embodiment of thepresent invention;

[0027]FIG. 8 illustrates a contactor of an eighth embodiment of thepresent invention;

[0028]FIG. 9 illustrates a contactor of a ninth embodiment of thepresent invention;

[0029]FIG. 10 illustrates a carrier of one embodiment of the presentinvention;

[0030]FIGS. 11A to 11C illustrate a method of producing the contactor ofthe first embodiment of the present invention;

[0031]FIG. 12 illustrates a first modification of a metal mold used forproducing a contactor;

[0032]FIG. 13 illustrates a second modification of a metal mold used forproducing a contactor;

[0033]FIGS. 14A to 14C illustrate a method of producing the contactor ofthe second embodiment of the present invention;

[0034]FIGS. 15A to 15C illustrate a method of producing the contactor ofthe fifth embodiment of the present invention; and

[0035]FIGS. 16A to 16C illustrate a method of producing the contactor ofthe seventh embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] The following is a description of embodiments of the presentinvention, with reference to the accompanying drawings.

[0037]FIGS. 1A and 1B show a semiconductor device testing contactor 10Aof a first embodiment of the present invention. FIG. 1A is a side view,and FIG. 1B is a plan view of the contactor 10A. In the figures, asemiconductor device 1 is mounted on the contactor 10A.

[0038] The contactor 10A is used in a test of the semiconductor device1. The semiconductor device 1 to be tested is mounted on the contactor10A, and various tests, such as a burn-in test, are conducted with it.The semiconductor device 1 comprises a semiconductor chip (a bare chip),a wafer, and a package structure such as BGA (Ball Grid Array), SOP(Small Outline Package), or QFP (Quad Flat Package).

[0039] The contactor 10A comprises a wiring board 11A and a firstreinforcing member 12A. In this embodiment, the wiring board 11A is amembrane-type wiring board.

[0040] The wiring board 11A of the membrane type includes a base film13A made of polyimide (PI), and a conductive pattern 14 formed on thebase film 13A. The conductive pattern 14 is made of copper foil, forinstance. In this structure, the wiring board 11A is flexible. Deviceconnecting pads 15 are formed on the inner end of the conductive pattern14, and are electrically connected to electrodes 2 disposed in thesemiconductor device 1. Outer connecting pads 16 are formed on the outerend of the conductive pattern 14, and are connected to othersemiconductor devices (not shown).

[0041] As the semiconductor device 1 is rapidly becoming small in size,and high in speed and density, the electrodes 2 are expected to besmaller accordingly. The membrane-type wiring board 11A of thisembodiment can have a minute conductive pattern 14 and minute connectingpads 15 and 16, so as to be compatible with the semiconductor device 1having minute electrodes 2.

[0042] The first reinforcing member 12A is disposed on the surface (rearsurface) opposite to the surface (front surface) of the wiring board 11Aonto which the semiconductor device 1 is connected.

[0043] The first reinforcing member 12A reinforces the wiring board 11A.With the conductive pattern 14 formed on the base film 13A, themembrane-type wiring board 11A has flexibility. Therefore, the wiringboard 11A needs a reinforcing member when used as a contactor for asemiconductor device. For this reason, the first reinforcing member 12Ais attached to the rear surface of the wiring board 11A so as toreinforce the wiring board 11A.

[0044] In this embodiment, the first reinforcing member 12A bonded tothe rear surface of the wiring board 11 is collectively molded with thewiring board 11A. A method of collectively molding and bonding thewiring board 11A and the first reinforcing member 12A is as follows.First, a wiring board 11A is mounted to a metal mold 40A, and then areinforcing material 45 to become the first reinforcing member 12A isinjected into the metal mold 40A, so that the wiring board 11A and thefirst reinforcing member 12A can be collectively bonded and molded.

[0045] With the integral bonding and molding of the wiring board 11A andthe reinforcing member 12A, conventionally required fixing means, suchas double-sided adhesive tape, adhesives, and screws, is not necessary,thereby reducing the number of components and the producing costs. Also,wrinkles can be prevented by eliminating the use of adhesives, and thereliability of the contactor can be improved in the connection to thesemiconductor device 1.

[0046] The wiring board 11A is made of a resin material such aspolyimide. The reinforcing material 45 to become the first reinforcingmember 12A is also made of resin. More specifically, the reinforcingmaterial 45 is made of a resin material, such as PES, PEI, or PPE.

[0047] In this embodiment, resin materials are chosen so that thethermal expansion of the resin material to become the wiring board 11Ais greater than the molding contraction of the resin material to becomethe first reinforcing member 12A when the first reinforcing member 12Ais formed. After the molding of the first reinforcing member 12A, thewiring board 11A can always maintain tension with the first reinforcingmember 12A. Thus, the wiring board 11A can be kept flat, and theelectric connection with the semiconductor device 1 can be improved.

[0048] The reinforcing material 45 to become the first reinforcingmember 12A is not limited to resin materials, and other materials can beused as long as the above relationship between the thermal expansion andthe molding contraction is maintained. If the wiring board 11A is madeof polyimide, the first reinforcing member 12A can be made of ceramic,glass, or silicon.

[0049]FIGS. 2A and 2B illustrate a contactor 10B of a second embodimentof the present invention. In the figures, the same reference numerals asin FIGS. 1A and 1B indicate the same components as in the contactor 10Aof the first embodiment. This also applies to all embodiments describedlater.

[0050] The contactor 10B comprises the wiring board 11A and the firstreinforcing member 12A. This contactor 10B is characterized by a coremember 17A formed on the surface (lower surface) opposite to the surfaceof the first reinforcing member 12A to which the wiring board 11A isbonded.

[0051] The core member 17A is made of a metal such as SCCP or SUS, andis collectively molded with the first reinforcing member 12A. In thisembodiment, the wiring board 11A, the first reinforcing member 12A, andthe core member 17A are collectively bonded and molded. Thus, thecontactor 10B has the same effects as the contactor 10A of the firstembodiment of reducing the number of components and the productioncosts, and improving the connection with the semiconductor device 1.

[0052] The core member 17A formed on the lower surface of the firstreinforcing member 12A restricts heat deformation of the firstreinforcing member 12A.

[0053] As described before, resin materials are chosen so that thethermal expansion of the wiring board 11A is greater than the moldingcontraction of the first reinforcing member 12A when the firstreinforcing member 12A is formed. After the molding of the firstreinforcing member 12A, the wiring board 11A can always maintain tensionwith the first reinforcing member 12A. Thus, the wiring board 11A can bekept flat.

[0054] However, if the difference between the thermal expansion of thewiring board 11A and the molding contraction of the first reinforcingmember 12A is too large, distortion might occur at the time of bondingand molding of the wiring board 11A and the first reinforcing member12A.

[0055] A two-percent molding contraction normally occurs in the firstreinforcing member 12A. By forming the core member 17A on the lowersurface of the first reinforcing member 12A, the molding contraction ofthe first reinforcing member 12A can be restricted so as to reducedistortion of the first reinforcing member 12A and deformation of thewiring board 11A caused at the time of bonding and molding of the wiringboard 11A and the first reinforcing member 12A. Here, a material usedfor the core member 17A should have a thermal expansion coefficientbetween the respective thermal expansion coefficients of the wiringboard 11A and the first reinforcing member 12A.

[0056] In this manner, the wiring board 11A can be prevented from beingdeformed and kept flat, even if there is a difference between thethermal expansion coefficients of the wiring board 11A and the firstreinforcing member 12A. Thus, the connecting reliability with thesemiconductor device 1 can be improved.

[0057]FIG. 3 illustrates a contactor 10C of a third embodiment of thepresent invention. The contactor 10C of this embodiment is substantiallythe same as the contactor 10B of the second embodiment, except that acore member 17B has an anchor portion 18 cutting into the firstreinforcing member 12A.

[0058] The anchor portion 18 is formed by the outer periphery of thecore member 17B being bent upward (into the side of the firstreinforcing member 12A which is bonded to the core member 17B). Theanchor portion 18 can be easily formed without an increase of theproduction costs.

[0059] The anchor portion 18 formed on the core member 17B reinforcesthe bond between the first reinforcing member 12A and the core member17B, so that distortion of the first reinforcing member 12A can be morerestricted, and that deformation of the wiring board 11A can also berestricted. Thus, the wiring board 11A can be kept flat, and theconnecting reliability with the semiconductor device 1 can be improved.

[0060]FIGS. 4A to 4C illustrate a contactor 10D of a fourth embodimentof the present invention. The contactor 10D is characterized by abonding area increasing portion 19A formed on the entire surface or on apart of the bonding region of a wiring board 11B to which the firstreinforcing member 12A is bonded. The bonding area increasing portion19A increases the bonding area between the wiring board 11B and thefirst reinforcing member 12A. In this embodiment, the bonding areaincreasing portion 19A is formed on the entire bonding area between thewiring board 11B and the first reinforcing member 12A.

[0061]FIG. 4B is an enlarged view of the circled area indicated by anarrow A in FIG. 4A. As shown in FIG. 4B, the rear surface of a base film13B of the wiring board 11B is made rough so as to form the bonding areaincreasing portion 19A. There are various ways of roughening the rearsurface of the base film 13B, including an air blast method and anetching method in which the base film 13B is etched.

[0062] As described above, the adhesion between the first reinforcingmember 12A and the wiring board 11B can be improved by roughening therear surface of the base film 13B so as to increase its surface area. Asthe bond between the first reinforcing member 12A and the wiring board11B is improved, the reinforcing power of the first reinforcing member12A for the wiring board 11B is increased. Also, the wiring board 11Band the first reinforcing member 12A can be prevented from being removedfrom each other, and the reliability of the contactor 10D can beimproved.

[0063] The structure of a bonding area increasing portion is not limitedto that of the bonding area increasing portion 19A formed by rougheningthe rear surface of the base film 13B shown in FIG. 4B. For instance,FIG. 4C shows a bonding area increasing portion 19B having protrusionsand cavities on the rear surface of the base film 13B. Small pores maybe formed on the rear surface of the base film 13B so as to form abonding area increasing portion. The roughness of the roughened surface,the height of the protrusions and the depth of the cavities, and thediameter of each pore are all adjustable, so that the bonding betweenthe first reinforcing member 12A and the wiring board 11B can beadjusted as desired.

[0064]FIG. 5 illustrates a contactor 10E of a fifth embodiment of thepresent invention. In the contactors 10A to 10D of the first to fourthembodiments, only the first reinforcing member 12A is disposed on therear surface of the wiring board 11A or 11B. The contactor 10E of thisembodiment is characterized by a second reinforcing member 20 formed onthe upper surface of a wiring board 11C (on the surface opposite to thesurface on which a first reinforcing member 12B is formed). The secondreinforcing member 20 reinforces the wiring board 11C.

[0065] In this embodiment, the first and second reinforcing members 12Band 20 are made of the same reinforcing material 45. Holes 21 are formedin the wiring board 11C where the first reinforcing member 12B and thesecond reinforcing member 20 face each other. The first reinforcingmember 12B and the second reinforcing member 20 are integrally connectedby the holes 21. The wiring board 11C, the first reinforcing member 12B,and the second reinforcing member 20 are collectively bonded and molded.

[0066] In the contactor 10E, the wiring board 11C is sandwiched by thefirst reinforcing member 12B and the second reinforcing member 20, sothat the wiring board 11C can be more reliably reinforced. Since thewiring board 11C, the first reinforcing member 12B, and the secondreinforcing member 20 are collectively bonded and molded, the number ofcomponents and the production costs can be reduced, and the connectionreliability with the semiconductor device 1 can be improved.

[0067] The bond between the first reinforcing member 12B and the secondreinforcing member 20 is strengthened, because the first reinforcingmember 12B and the second reinforcing member 20 are integrally connectedvia the holes 21 formed in the wiring board 11C. Thus, the contactor 10Eis also strengthened, and the reinforcing members 12B and 20 can besurely prevented from being removed from the wiring board 11C.

[0068] Although the first reinforcing member 12B and the secondreinforcing member 20 are made of the same reinforcing material in thisembodiment, it is possible to form the first reinforcing member 12B andthe second reinforcing member 20 from two different reinforcingmaterials. In such a case, there will be a difference in thermalcontraction between the upper surface and the lower surface of thewiring board 11C. The first and second reinforcing members 12B and 20can be prevented from being deformed by setting suitable thermalexpansion coefficients for the respective reinforcing materials.

[0069] The holes 21 are not essential in this embodiment, and it ispossible to separately form the first reinforcing member 12B and thesecond reinforcing member 20 on the wiring board 11C (for instance, toform the second reinforcing member 20 after forming the firstreinforcing member 12B).

[0070]FIG. 6 illustrates a contactor 10F of a sixth embodiment of thepresent invention.

[0071] Each of the contactors 10A to 10E of the first to fifthembodiments has the flat first reinforcing member 12A or 12B. On theother hand, the contactor 10F of this embodiment has an opening 22 in afirst reinforcing member 12C, and the opening 22 faces the area on thewiring board 11A on which the semiconductor device 1 is mounted. Theopening 22 has a rectangular shape corresponding to the shape of thesemiconductor device 1, and vertically penetrates the first reinforcingmember 12C.

[0072] The area of the wiring board 11A that faces the opening 22 can beflexible, having no supporting member on its rear surface. If thesemiconductor device 1 mounted on the contactor 10F pushes the wiringboard 11A facing the opening 22, an elastic restoring force occurs inthe wiring board 11A.

[0073] The elastic restoring force pushes the device connecting pads 15formed on the wiring board 11A toward the electrodes 2 of thesemiconductor device 1. The device connecting pads 15 are then broughtinto contact with the electrodes 2 of the semiconductor device 1,thereby surely connecting the semiconductor device 1 and the wiringboard 11A.

[0074]FIG. 7 illustrates a contactor 10G of a seventh embodiment of thepresent invention. The contactor 10G of this embodiment is substantiallythe same as the contactor 10F of the sixth embodiment. The contactor 10Gof this embodiment is characterized by a back-up member 23 formed in theopening 22 in the first reinforcing member 12C. The back-up member 23 ismade of an elastic material such as elastomer or silicon rubber.

[0075] The wiring board 11A has the conductive pattern 14 formed on thebase film 13A, and can be easily bent. In the contactor 10F of the sixthembodiment shown in FIG. 6, the wiring board 11A may not be able toendure a pressing force from the semiconductor device 1. Therefore, theback-up member 23 made of an elastic material is disposed in the opening22 in this embodiment. The back-up member 23 supports the wiring board11A, so that the wiring board 11A can be protected from a strongpressing force from the semiconductor device 1.

[0076] The elasticity of the back-up member 23 can be adjusted asdesired, so that the elastic restoring force caused at the time ofmounting the semiconductor device 1 on the wiring board 11A can becontrolled. Thus, the connection between the device connecting pads 15formed on the wiring board 11A and the electrodes 2 of the semiconductordevice 1 can be made optimum.

[0077] Even if there are height variations among the device connectingpads 15 and the electrodes 2 of the semiconductor device 1, suchvariations are compensated for by elastic deformation of the backupmember 23. Excellent connection can be maintained in spite of the heightvariations.

[0078]FIG. 8 illustrates a contactor 10H of an eighth embodiment of thepresent invention. The contactor 10H has a film member 24 interposedbetween the wiring board 11A and the back-up member 23. The film member24 allows relative displacement between the wiring board 11A and theback-up member 23. The film member 24 has thermal resistance andsmoothness. For instance, a thermal-resistant fluororesin film can beused for the film member 24.

[0079] The film member 24 interposed between the wiring board 11A andthe back-up member 23 allows relative displacement between the wiringboard 11A and the back-up member 23, so that a stable test can beconducted even if the test involves heating.

[0080] If a test involving heating, such as a burn-in test, is conductedon the semiconductor device 1, heat is also applied to the back-upmember 23, resulting in thermal expansion or thermal contraction of theback-up member 23. Since an elastic material tends to be greatlydeformed by heat, the thermal deformation of the back-up member 23 islarge when heat is applied. With the back-up member 23 being directly incontact with the wiring board 11A, thermal deformation of the back-upmember 23 might cause deformation of the wiring board 11A.

[0081] The film member 24 interposed between the wiring board 11 a andthe back-up member 23 can prevent the back-up member 23 from adverselyinfluencing the wiring board 11A, because the back-up member 23 slideson the film member 24 when the back-up member 23 is thermally expandedor contracted. Even if the contactor 10H is used for a test involvingheating, excellent connection between the wiring board 11A and thesemiconductor device 1 can be maintained, and stable testing can becarried out.

[0082]FIG. 9 illustrates a contactor 10I of a ninth embodiment of thepresent invention. The contactor 10I is the same as the contactor 10G ofthe seventh embodiment, except that the core member 17A is bonded to thelower surface of the first reinforcing member 12C.

[0083] The core member 17A can be formed on the lower surface of thefirst reinforcing member 12C having the opening 22. The core member 17Acan prevent the wiring board 11A and the first reinforcing member 12Cfrom being deformed.

[0084]FIG. 10 illustrates a semiconductor device carrier 25 (hereinafterreferred to as the “carrier 25”) of one embodiment of the presentinvention.

[0085] The carrier 25 comprises a contactor 10J and a pressure mechanism28. The contactor 10J includes the wiring board 11A and a firstreinforcing member 12D.

[0086] The wiring board 11A and the first reinforcing member D arecollectively bonded and molded, so that the number of components and theproduction costs can be reduced, and that the connection reliabilitywith the semiconductor device 1 can be improved. The first reinforcingmember 12D has a cushion member 27, and the cushion member 27 faces thesemiconductor device 1.

[0087] The pressure mechanism 28 includes stopper members 29, a cap 30,a pressure plate 32, and pressure springs 33. The stopper members 29stand from the first reinforcing member 12D, and have stopper claws 29Aat the ends.

[0088] The cap covers the semiconductor device 1 mounted on the wiringboard 11A, and protects the semiconductor device 1. The cap 30 has aflange 31 extending outward from the lower rim. The flange 31 is engagedwith the stopper claws 29A formed on the stopper members 29. The upperends of the pressure springs 33 are fixed to the roof of the cap 30, andthe lower ends of the pressure springs 33 are connected to the pressureplate 32.

[0089] To mount the semiconductor device 1 to the carrier 25, thesemiconductor device 1 is first mounted to the contactor 10J, with thecap 30 being removed. The cap 30 is then attached to the stopper members29. Here, the flange 31 is engaged with the stopper claws 29A so as tosecure the cap 30, and the pressure plate 32 presses the semiconductordevice 1 toward the contactor 10J with the help of the pressure springs33.

[0090] In this manner, the semiconductor device 1 and the contactor 10Jcan have an excellent connection. Even if the spring force of thepressure springs 33 is too large, the excellent connection between thesemiconductor device 1 and the contactor 10J can be maintained by virtueof the flexibility of the cushion member 27 provided on the firstreinforcing member 12D that faces the mounted semiconductor device 1.The cushion member 27 can also absorb height irregularities of theelectrodes 2 of the semiconductor device 1 and the device connectingpads 15 of the contactor 10J.

[0091] Although the contactor 10J having the cushion member 27 is usedin this embodiment, any of the contactors 10A to 10I may be used. Thecarrier 25 of this embodiment has the effects of the contactors 10A to10I.

[0092]FIGS. 11A to 11C illustrate a method of producing the contactor10A of the first embodiment shown in FIGS. 1A and 1B. The method ofproducing the contactor 10A includes a mounting step and a reinforcingmember forming step.

[0093]FIG. 11A illustrates the mounting step. In this step, the wiringboard 11A is mounted to the metal mold 40A. The metal mold 40A is madeup of an upper mold 41A and a lower mold 42A. The bottom surface of theupper mold 41A is flat, and the lower mold 42A has a lower mold cavity43 having a shape corresponding to the shape of the first reinforcingmember 12A. Further, a gate 44 which communicates with the lower cavity43 is formed on one side of the lower mold 42A. The reinforcing material45 to become the first reinforcing member 12A is introduced through thegate 44.

[0094] The wiring board 11A is formed in advance by carrying out asubstrate forming step. The wiring board 11A is interposed between theupper mold 41A and the lower mold 42A. The upper mold 41A and the lowermold 42A are clamped by a pressing device (not shown) so as to securethe wiring board 11A.

[0095] Positioning holes for positioning the wiring board 11A and thelower cavity 43 may be formed in the wiring board 11A. When attachingthe wiring board 11A to the metal mold 40A, the conductive pattern 14faces the upper mold 41A, and the base film 13A faces the lower mold42A.

[0096] The mounting step is followed by the reinforcing member formingstep. FIG. 11B illustrates the reinforcing member forming step. In thereinforcing member forming step, the reinforcing material 45 is injectedinto the lower cavity 43 through the gate 44 from an injection moldingdevice (not shown). Thus, the reinforcing material 45 injected into thelower cavity 43 is integrally bonded with the wiring board 11A.

[0097] The lower cavity 43 filled with the reinforcing material 45 iscooled, and the metal mold 40A is split into the upper mold 41A and thelower mold 42A, thereby completing the contactor 10A shown in FIG. 11C.

[0098] As described above, the method of this embodiment eliminates thebonding process required when using double-sided adhesive tape oradhesives, and the fastening process required when using screws. Thus,the production procedures of the contactor 10A can be simplified.

[0099]FIG. 12 illustrates a metal mold 40B which is a first modificationof the metal mold 40A.

[0100] The metal mold 40B is characterized by a heating and coolingdevice 46 disposed inside an upper mold 41B. The heating and coolingdevice 46 heats and cools the upper mold 41B. A control unit (not shown)switches the heating and cooling device 46 between heating and cooling.The control unit also sets a temperature for the device 46.

[0101] The heating and cooling device 46 disposed in the metal mold 40Bcan vary the temperature of heat applied to the wiring board 11A in thereinforcing member forming step. The heating and cooling device 46 cancontrol the temperature of the wiring board 11A, so that the heatexpansion of the wiring board 11A becomes larger than the moldingcontraction of the first reinforcing member 12A at the time of formingthe first reinforcing member 12A.

[0102] After the formation of the first reinforcing member 12A, thewiring board 11A can always keep tension with the first reinforcingmember 12A. Thus, the wiring board 11A can be always flat, and theconnection between the semiconductor device 1 and the contactor 10 canbe improved.

[0103]FIG. 13 illustrates a metal mold 40C which is a secondmodification of the metal mold 40A.

[0104] The metal mold 40C is characterized by tension members 47provided on both sides. The tension members 47 are moved by a device(not shown) in directions indicated by arrows in the figure. Each of thetension members 47 has fixing screws 49 to be inserted into holes 48formed in a wiring board 11D.

[0105] With the fixing screws 49 inserted into the holes 48 formed inthe wiring board 11D, the tension members 47 are moved in the directionindicated by the arrows in the figure, so that the wiring board 11D ispulled.

[0106] In the reinforcing member forming step, the first reinforcingmember 12A is formed while a tension load is applied to the wiring board11D by the tension members 47. Thus, the wiring board 11D remains pulledafter the formation of the first reinforcing member 12A, therebymaintaining the flatness of the wiring board 11D.

[0107]FIGS. 14A to 14C illustrate a method of producing the contactor10B of the second embodiment of the present invention. In the figures,the same components as in FIGS. 11A to 11C are indicated by the samereference numerals as in FIGS. 11A to 11C. This also applies to othermethods shown in FIGS. 15A to 16C to be described later.

[0108] The method of this embodiment is characterized by attaching thecore member 17A to the bottom surface of the lower cavity 43 in themounting step. The contactor 10B can be produced by attaching the coremember 17A to the lower cavity in the mounting step of the method ofproducing the contactor 10A. In this manner, the contactor 10A of thefirst embodiment and the contactor 10B can be produced without changingthe metal mold 40A. Thus, the production costs of the metal mold can bereduced, and the production procedures can be simplified.

[0109]FIGS. 15A to 15C illustrate a method of producing the contactor10E of the fifth embodiment shown in FIG. 5.

[0110] The upper mold 41C of a metal mold 40D used for producing thecontactor 10E has an upper cavity 50 having a shape corresponding to theshape of the second reinforcing member 20. The holes 21 are formed inadvance in the position where the second reinforcing member 20 is formedon the wiring board 11C.

[0111] The contactor 10E is produced by clamping the wiring board 11Cbetween the upper mold 41C and the lower mold 42A, with the upper cavity50 facing the holes 21 in the mounting step. Here, the core member 17Ais placed in the lower cavity 43 in advance.

[0112] In the reinforcing member forming step, the reinforcing material45 is injected into the metal mold 40D, so that the first and secondreinforcing members 12B and 20 are collectively bonded with the wiringboard 11C. The reinforcing material 45 injected into the lower cavity 43through the gate 44 of the lower mold 42A also fills the upper cavity 50through the holes 21.

[0113] In the above manner, the contactor 10E having the firstreinforcing member 12B and the second reinforcing member 20 integrallyformed through the holes 21 is produced. Since the second reinforcingmember 20 is collectively bonded with the first reinforcing member 12Band the wiring board 11C, the production procedures is not complicated.

[0114]FIGS. 16A to 16C illustrate a method of producing the contactor10G of the seventh embodiment shown in FIG. 7.

[0115] The contactor 10G is produced by using the metal mold 40A as inthe methods of producing the contactors of the first and secondembodiments. In the mounting step, the back-up member 23 is attached tothe bottom surface of the lower cavity 43.

[0116] The contactor 10G is produced by simply attaching the back-upmember 23 to the lower cavity 43 in the mounting step of the method ofproducing the contactor 10A of the first embodiment. In this manner, anyof the contactors 10A, 10B, and 10G can be produced with the same metalmold 40A. Thus, the production costs of the metal mold can be reduced,and the production procedures can be simplified.

[0117] Since the back-up member 23 is made of an elastic material suchas rubber, the heat applied to the back-up member 23 in the reinforcingmember forming step might cause gas. If the gas remains in the firstreinforcing member 12C, the gas turns into a void which lowers thestrength of the first reinforcing member 12C. To remove the gas, gasreleasing holes may be formed in the wiring board 11A and the upper mold41A.

[0118] Although the present invention has been fully described by way ofexamples with reference to the accompanying drawings, it is to be notedthat various changes and modifications will be apparent to those skilledin the art. Therefore, unless otherwise such changes and modificationsdepart from the scope of the present invention, they should be construedas being included therein.

[0119] The present application is based on Japanese priority applicationNo. 10-365587, filed on Dec. 22, 1998, the entire contents of which arehereby incorporated by reference.

What is claimed is:
 1. A device testing contactor comprising: a wiringboard having a flexible substrate and electrode pads formed on thesubstrate, the electrode pads being electrically connected to electrodesof a device; and a first reinforcing member formed by a mold, whichfirst reinforcing member reinforces the wiring board, wherein the wiringboard and the first reinforcing member are collectively bonded andmolded.
 2. The device testing contactor according to claim 1, furthercomprising a core member which restricts thermal deformation of thefirst reinforcing member, wherein the wiring board, the firstreinforcing member, and the core member are collectively bonded andmolded.
 3. The device testing contactor according to claim 2, whereinthe core member is provided with anchor portions cutting into the firstreinforcing member.
 4. The device testing contactor according to claim1, wherein the wiring board is made of a material which exhibits athermal expansion greater than a molding contraction of the firstreinforcing member when the first reinforcing member is formed by themold.
 5. The device testing contactor according to claim 1, wherein abonding area increasing portion is formed on a bonding surface of thewiring board to which the first reinforcing member is bonded, so as toincrease a bonding area between the wiring board and the firstreinforcing member.
 6. The device testing contactor according to claim1, further comprising a second reinforcing member formed on a surface ofthe wiring board opposite to a surface of the wiring board to which thefirst reinforcing member is bonded, the second reinforcing memberreinforcing the wiring board, wherein the wiring board, the firstreinforcing member, and the second reinforcing member are collectivelybonded and molded.
 7. The device testing contactor according to claim 6,wherein the first reinforcing member and the second reinforcing memberare integrally connected via holes formed in the wiring board.
 8. Thedevice testing contactor according to claim 1, wherein the wiring boardis of a membrane type.
 9. The device testing contactor according toclaim 1, wherein the first reinforcing member has an opening.
 10. Thedevice testing contactor according to claim 9, further comprising aback-up member made of an elastic material in the opening.
 11. Thedevice testing contactor according to claim 10, where in a film memberis interposed between the wiring board and the back-up member, so thatrelative displacement is possible between the wiring board and theback-up member.
 12. A device testing carrier comprising: a devicetesting contactor; a pressure mechanism which pushes a device toward awiring board provided in the device testing contactor; and a cushionmember which absorbs a pressing force of the pressure mechanism.
 13. Amethod of producing a device testing contactor comprising the steps of:mounting a wiring board to a metal mold made up of an upper mold and alower mold provided with a lower cavity having a shape corresponding toa shape of a first reinforcing member; and forming the first reinforcingmember by injecting a reinforcing material into the metal mold, so thatthe wiring board and the first reinforcing member are collectivelybonded.
 14. The method according to claim 13, wherein the step ofmounting the wiring board includes the step of attaching a core materialto the lower cavity.
 15. The method according to claim 13, wherein thestep of mounting the wiring board includes the step of disposing aback-up member in the lower cavity in a place facing a mounting positionon the wiring board.
 16. The method according to claim 13, wherein: anupper cavity having a shape corresponding to a shape of a secondreinforcing member is formed in the upper cavity of the metal mold; andthe reinforcing member forming step includes the step of injecting thereinforcing material into the metal mold so that the first and secondreinforcing members and the wiring board are collectively bonded. 17.The method according to claim 16, wherein: the wiring board has throughholes in predetermined positions; and the reinforcing member formingstep includes the step of integrally connecting the first and secondreinforcing members via the through holes.
 18. The method according toclaim 13, wherein the reinforcing member forming step includes the stepof controlling a temperature of the wiring board so that a thermalexpansion of the wiring board is larger than a molding contraction ofthe reinforcing member.
 19. The method according to claim 13, whereinthe reinforcing member is formed while a tension load is applied to thewiring board in the reinforcing member forming step.
 20. A method oftesting a device, comprising the step of: electrically connectingelectrode pads of a device testing contactor to electrodes of a devicebeing tested; the electrode pads being formed on a wiring board of thedevice testing contactor, and being reinforced by a reinforcing member,and the device testing contactor comprising the wiring board and thereinforcing member collectively bonded to each other.